CETC Silicon Carbide (SiC) Process Equipment
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Magnetron sputtering coater
Adjustable target base distance
Sputtering angle adjustable
Sputtering angle adjustable
- Introduction
- Feature
- Parameters
- Application scope
Magnetron sputtering equipment is a multi-functional, high efficiency coating equipment.Thin films of metal, nonmetal, oxide, medium and other materials can be sputtered on substrates such as ceramics, glass, quartz, silicon wafer, etc., such as Au, Al, NiCr, TiW, Si, Al2O3, Si3N4, ZnO, ITO, etc.The spray coating is uniform, compact and has strong adhesion. It can be applied to the preparation of new electronic materials, optics, solar energy, semiconductor and other fields.
- The sputtering target angle can be adjusted;
There are two sputtering modes: single sputtering and co sputtering;
It has many sputtering targets, and can deposit single-layer, multi-layer, alloy and doped films;
The sputtering targets are isolated from each other to ensure that there is no mutual pollution between the targets;
Sputtering mode: bottom-up sputtering, top-down sputtering optional;
The substrate can be heated, and the single crystal film can be prepared by process control;
The auxiliary cleaning ion source can be selected to effectively improve the adhesion of the film;
Power configuration options: DC, RF, DC pulse, DC bias, RF bias;
It has the characteristics of small target sputtering large substrate. 
- -Target size: Φ 50mm, Φ 75mm, Φ 100mm, Φ 125mm, Φ 150mm
-Number of targets: 2-4
-Substrate size: 2-8 inches
-Substrate table speed: 5-30rpm, continuously adjustable
-Substrate table heating: room temperature - 400 ℃, temperature control accuracy ± 1%
-Nonuniformity of membrane deposition: ± 3% ～ ± 5%
-Vacuum system: molecular pump system / cryopump system 
- Various kinds of metal, nonmetal, compound and other thin film materials are plated on the surface of flat substrate.Such as Al, Cu, Au, Pt, Ti, Ni, W, NiCr, TiW, SiO2, Al2O3, TiO2, ZnO, Tan, ITO and other thin films.
ADVISORY MESSAGEA
